EURADOS Young Scientist Conference Support (YSCS) 2023 - UPDATE!

EURADOS invites Young Scientists who are presenting their work at relevant conferences to apply for the EURADOS Young Scientist Conference Support (YSCS). The YSCS will consist of a sum up to 500 € to contribute covering either the conference fee and/or the travel and/or the subsistence costs, up to the applicant’s choice and following the EURADOS reimbursement rules.

The events and conferences in 2023 selected by EURADOS:

1. ISORED 2023
   1st meeting of the International Society of Radiation Epidemiology and Dosimetry
   Hybrid meeting - 16-18 May 2023 in Sitges, Spain
   Number of YSCS: 1
   Application deadline: 31 March 2023

2. EURADOS AM2023^*)
   Annual Meeting of the European Radiation Dosimetry Group e.V.
   12-15 June 2023 in Porto, Portugal
   Number of YSCS: 1
   Application deadline: 15 April 2023

3. SSD 20
   International Solid State Dosimetry Conference
   17–23 September 2023 in Viareggio (near Pisa), Italy
   Number of YSCS: 2
   Application deadline: 15 May 2023

4. EANM 2023
   36^th Annual Congress of the European Association of Nuclear Medicine
   9-13 September 2023 in Vienna, Austria
   Number of YSCS: 1
   Application deadline: 30 June 2023

5. ICDA-4
   4^th International Conference on Dosimetry and its Applications
   16-20 October 2023 in Valencia, Spain
   Number of YSCS: 2
   Application deadline: 30 June 2023

*) For the AM2023, the applicant shall not be a full member of an EURADOS Working Group and, instead of proof of abstract/paper to the event, at the moment of application she/he has to provide a presentation to be held at one of the WG meetings.

Further events in late 2023 will be supported: for example, 4 YSCS are foreseen for the European Radiation Protection Week 2023, 1 YSCS for the ICRP 2023 Symposium. Announcement with details on deadline applications will be issued as soon as further information on the above mentioned events is available. Please follow the announcements on our website or in the newsletter.